Company details
Vitesse Semiconductor Corp. Feb 4, 2009
About this company
Vitesse Semiconductor Corp.
741 Calle Plano
Camarillo
California
93012
United States
Tel:
+1.805.388.3700
Vitesse designs, develops and markets a diverse portfolio of high-performance, cost-competitive semiconductor solutions for communications and storage networks worldwide.
Categories
Products from this company
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Vitesse Chipset Enables Next-Generation Fiber-to-the-Home Deployments Mar 23, 2009
Industry's First Standards Compliant 10G-EPON Chipset Assures a Smooth Transition to Faster Data Rates and Enhanced User Experience
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Vitesse Sets Performance Standards for Signal Integrity Solutions Feb 3, 2009
Carrier and Enterprise Network Equipment Providers Able to Transmit Signals Farther, Faster and Error-Free
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Advanced Vitesse SONET/SDH Clock & Data Recovery Device Sets New Standards Dec 10, 2008
Next-Generation STS-3/12, STM-1/4 Low-Power Device Offers Industry's Best Jitter Transfer and Power Dissipation
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VSC3406 Device Expands Vitesse's Performance-Leading Signal Integrity portfolio Nov 18, 2008
Vitesse Unleashes VScope™ Embedded Waveform Viewing Technology for 1.5 Gbps and 3 Gbps HD-SDI Video Broadcast Applications
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Laser Driver Chip Set Provides First Comprehensive Solution for SFP+ Transceiver Sep 9, 2008
Industry’s First Solution to Meet End-of-Life Power Requirement of Multiple New 10 Gbps Fiber Optic Module Standards
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The new 6.375G SerDes Solution with VScope™ Waveform Viewing Technology Aug 14, 2008
Industry-First Multi-Protocol Solution Integrates SerDes, Signal Integrity and VScope™ Functionality
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Vitesse Unveils VScope™ Embedded Waveform Viewing Technology to Revolutionize Signal Integrity Analysis Jan 23, 2008
CAMARILLO, Calif -Vitesse Semiconductor Corporation (Pink Sheets:VTSS) is providing system designers with new possibilities to redefine the dynamics and economies of backplane design, signal integrity analysis, test & measurement equipment
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Vitesse Delivers Second Generation Electronic Dispersion Compensation ICs for 10 GbE Fiber Applications Dec 17, 2007
Follows Market-Leading, First-Generation EDC Device with Low-Power CMOS Implementation for SFP+, Backplane and Copper Interconnect Applications